The question then is: what kind of privacy screen you should add to the deck railing design? If this is what you have in mind right now, you are in the right place. With it, you can enjoy your time there conveniently without having to worry about spying eyes.

It is especially when the place is an extended living area that you usually use for different activities, like cooking, barbequing, sitting, eating, or even relaxing.ĭo you know why we say that you must get the screen? Just like the name, it is beneficial in adding extra privacy in the deck area. What’s Next: Building on the momentum of recent PowerVia and RibbonFET breakthroughs, these industry-leading glass substrates for advanced packaging demonstrate Intel’s forward focus and vision for the next era of compute beyond the Intel 18A process node. Intel is on the path to delivering 1 trillion transistors on a package by 2030 and its ongoing innovation in advanced packaging including glass substrates will help achieve this goal.Privacy screen for deck railing is a must-have accessory. As a result, Intel has been able to unlock an entire ecosystem around these technologies from equipment, chemical and materials suppliers to substrate manufacturers. The company has a long history of enabling next-generation packaging, having led the industry in the transition from ceramic package to organic package in the 1990s, being the first to enable halogen and lead-free packages, and being the inventor of advanced embedded die packaging technologies, the industry’s first active 3D stacking technologies. How We Do It: Intel has been researching and evaluating the reliability of glass substrates as a replacement for organic substrates for more than a decade. These many benefits bring the industry closer to being able to scale 1 trillion transistors on a package by 2030. This allows for better power delivery solutions while achieving high-speed signaling that is needed at much lower power. Glass substrates’ tolerance to higher temperatures also offers chip architects flexibility on how to set the design rules for power delivery and signal routing because it gives them the ability to seamlessly integrate optical interconnects, as well as embed inductors and capacitors into the glass at higher temperature processing. Further, improved mechanical properties of glass enable ultra-large form-factor packages with very high assembly yields. As a result of these distinctive properties, a 10x increase in interconnect density is possible on glass substrates. Glass substrates can tolerate higher temperatures, offer 50% less pattern distortion, and have ultra-low flatness for improved depth of focus for lithography, and have the dimensional stability needed for extremely tight layer-to-layer interconnect overlay.

Chip architects will have the ability to pack more tiles – also called chiplets – in a smaller footprint on one package, while achieving performance and density gains with greater flexibility and lower overall cost and power usage.Ībout the Use Cases: Glass substrates will initially be introduced into the market where they can be leveraged the most: applications and workloads requiring larger form factor packages (i.e., data centers, AI, graphics) and higher speed capabilities. How It Works: As the demand for more powerful computing increases and the semiconductor industry moves into the heterogeneous era that uses multiple “chiplets” in a package, improvements in signaling speed, power delivery, design rules and stability of package substrates will be essential. Glass substrates possess superior mechanical, physical and optical properties that allow for more transistors to be connected in a package, providing better scaling and enabling assembly of larger chiplet complexes (called “system-in-package”) compared to organic substrates in use today. Scaling is crucial to the progress and evolution of the semiconductor industry, and glass substrates are a viable and essential next step for the next generation of semiconductors. Intel is on track to deliver complete glass substrate solutions to the market in the second half of this decade, allowing the industry to continue advancing Moore’s Law beyond 2030.īy the end of the decade, the semiconductor industry will likely reach its limits on being able to scale transistors on a silicon package using organic materials, which use more power and include limitations like shrinkage and warping. These benefits will allow chip architects to create high-density, high-performance chip packages for data-intensive workloads such as artificial intelligence (AI).

Why It Matters: Compared to today’s organic substrates, glass offers distinctive properties such as ultra-low flatness and better thermal and mechanical stability, resulting in much higher interconnect density in a substrate.

Deck privacy panels